Center NETSI offers:

The designing of new and upgrading of existing equipment on the basis of high-tech installations for depositing protective coatings, the high-rate ionic - plasma magnetron sputtering systems of planar and coaxial (tubular) types and the modules required for their embedding in different sorts of working vacuum volumes of the installations designed; equipping the above mentioned installations by "hi-tech" devices and targets with modern systems of assisting technological processes; all the services complex linked with  assembling, putting into operation, following maintenance and (author) supervision.

The characteristic features of the high-rate ionic - plasma magnetron sputtering systems of planar and coaxial (tubular) types offered are:

·         Direct intensive cooling of targets allowing to reach the power density of discharge up to 10³ W/ñm²;

·         Strong balanced magnetic field securing high concentration of plasma;

·         High simplicity of magnetron design in assembling and work;

·        Equal deposition rate for different target materials.

There are the following sputtering systems:

·         Magnetrons with disk cathodes - DC-series: cathode dia from 50 mm up 250 mm; for example, there is DC-1 mini with the sputtering area less than 2 ñm²; the magnetron is designed for sputtering the precious metals and R & D works being very effective, highly economical;

·         Magnetrons with extended cathodes – EC-series: cathode plates of 60-70 mm width and up to 1500 mm and more in length;

·         Magnetrons with liner/bush movable cathodes – LMC-series: external dia  from 50 mm and more and thickness up to 500 mm; such magnetrons can be utilized for long coating deposition due to mobile cathodes providing the sputtering process from both solid and liquid (ionic-thermal process) phases;

·         Magnetrons with tubular cathodes – TC-series and movable magnetic system: cathode dia from 10 mm and more and length up to 7500 mm; such magnetrons could be single or multi sectional. Single magnetic system magnetron secures the power density of discharge: (i) up to 10³ W/ñm² while sputtering from solid phase and (ii) 10⁴ W/ñm² while sputtering from liquid phase. Liquid phase sputtering requires high linear speed of more than 100 m/sec plus intensive cooling with water of temperature of 10-12 ^îÑ. Specially adjusted magnetic system allows having coating deposition at the distance of 7-10 mm.

Below the basic characteristics for some magnetrons series: DC, EC, LMC, TC are given (the numbers after the series mean major cathode size; for example: DC-50 means cathode dia of 50 mm; EC-300 means cathode length of 300 mm)